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RDK X5 Modular Case

The first open-source 3D-printable case for D-Robotics RDK X5 8GB. Fully parametric OpenSCAD source. One base, four swappable lids. Licensed under CC BY 4.0.

RDK X5 seated in the base — every port lined up

Closed lid snapping on Fan lid snapping on

Snap-on lids over a board held by an outer clamp — no PCB-side screws.

Why this exists

As of May 2026, RDK X5 has no community 3D-printable case on Printables, Thingiverse, Cults3D, or English-language MakerWorld. The official metal/acrylic cases from Yahboom, Waveshare, and DFRobot are heavy and don't fit inside robot bodies. This repo fills that gap with a community-first, remix-friendly modular design.

Originally built as a byproduct of Project Korosuke (コロ助), an animatronic robot competing in the D-Robotics Robotics Dream Keeper Challenge.

One base, four lids

Lid Preview STL Use case
Default (closed, cooling slits) lid_default.stl Everyday use, dust protection, mild cooling
Open (honeycomb vent) lid_open.stl Maker projects, full heatsink exposure, max airflow
VESA Mount (50×50 M4) lid_vesa.stl 50 mm 4-hole bracket mount (board is too small for full VESA-75)
Fan (40 mm fan mount) lid_fan.stl Active cooling — mount a 40 mm fan (e.g. 4010) over a honeycomb intake grille

Common base: case_base.stl — works with all four lids.

Powering the fan

The Fan lid takes a standard 40 × 40 × 10 mm (4010) 5 V fan, held by 4× M3 × 15 mm screws on the 32 mm pattern — that length is a perfect fit through the fan into the lid bosses. The center honeycomb doubles as a finger guard and intake grille; the fan blows down onto the heatsink.

⚠️ The RDK X5's onboard fan header (J15) is a JST-SH 1.0 mm 2-pin and is too small for most hobby-fan plugs. The simplest reliable hookup is the 40-pin GPIO header: fan + (red) → pin 4 (5V), − (black) → pin 6 (GND). This runs the fan full-speed whenever the board is powered.

Measured cooling (assembled, lid on): idle 66 °C passive → 41 °C with the 4010 fan ducted through the honeycomb — a −25 °C drop, plenty of headroom for running YOLO on the BPU.

Base

Specifications

Item Value
Compatible board D-Robotics RDK X5 8GB (Part No. DROBOTICS-RDK-X5-8GB-V10)
Reference source Official D-Robotics V1P0 DXF & STEP (reference/)
Case footprint ~89 × 60 × 24 mm
PCB retention Outer clamp (no PCB-side screws — preserves stock heatsink holes)
Lid attachment Snap / press-fit — no screws (tunable via SNAP_CLEAR)
Designed material PLA / PETG (2.0 mm wall)
License CC BY 4.0

Build (STL from source)

Requires OpenSCAD 2021.01 or newer.

# Render all parts in one go
openscad -o stl/case_base.stl   -D 'SHOW=11' rdk_x5_case.scad
openscad -o stl/lid_default.stl -D 'SHOW=12' rdk_x5_case.scad
openscad -o stl/lid_open.stl    -D 'SHOW=13' rdk_x5_case.scad
openscad -o stl/lid_vesa.stl    -D 'SHOW=14' rdk_x5_case.scad
openscad -o stl/lid_fan.stl     -D 'SHOW=25' rdk_x5_case.scad
# (SHOW=11–14,25 = print-ready, flat on Z=0. SHOW=1–4,15 = design orientation.)

Or run ./build_all.sh (Linux/macOS) / build_all.ps1 (Windows).

Print settings (suggested starting point)

Parameter Value
Layer height 0.20 mm
Walls / Perimeters 3
Top/Bottom layers 4 / 4
Infill 20 % (gyroid)
Supports None needed — designed support-free
Brim Optional (5 mm) for warping-prone filaments
Filament PLA, PETG, or PC-blend; ABS optional

Customization

Open rdk_x5_case.scad and edit the // PARAMETERS block. Useful knobs:

Variable Default When to change
GAP 1.0 mm Per-side PCB clearance. Lower (0.8) for a snug board, raise if it binds. Printers with elephant's foot may need more — or enable foot compensation in the slicer
SNAP_CLEAR 0.05 mm Lid lip press-fit. Lower = tighter lid; negative = interference
SNAP_BEAD 0.45 mm Snap ridge/groove engagement depth. Raise for a firmer click, lower if the lid won't close
TOP_CLEAR 20 mm Increase if using a tall heatsink + fan
WALL 2.2 mm Drop to 1.6 for ABS, raise to 3.0 for TPU
VESA 50 (50×50 M4) Max that fits on the 56 mm-deep lid; an assert guards against overhang

Roadmap

  • Default Lid — closed + cooling slits
  • Open Lid — frame with X-cross ribs
  • VESA Mount Lid — 50×50 M4 pattern (bosses fully supported on the lid)
  • Fan Lid — 40 mm fan mount (32 mm M3 pattern) with honeycomb intake grille
  • Accurate port cutouts — every connector position extracted from the official STEP model and verified against the real board mesh (USB-A ×2, RJ45, HDMI, audio, USB-C ×2, UART debug, 40-pin GPIO, microSD, fan). See connector_map.md and images/board_fit_verification.png.
  • Camera Lid — MIPI CSI cable pass-through (planned)
  • DIN-rail Lid — industrial mount (community request welcome)
  • Print validation on real hardware (PLA / PETG)
  • Thermal validation under load

Disclaimer

This is an unofficial community design. Not affiliated with or endorsed by D-Robotics. PCB outline geometry is derived from D-Robotics' publicly released DXF/STEP mechanical drawings (reference/); those original CAD files remain the property of D-Robotics and are included for design verification only.

License

CC BY 4.0 — see LICENSE. You may share and adapt freely, including commercially, as long as you give credit.

Acknowledgments

  • D-Robotics for publishing the mechanical reference files openly.
  • Lisa Li and the Robotics Dream Keeper Challenge team for the warm welcome.
  • The Korosuke / コロ助 character from Kiteretsu Daihyakka — the spark for this entire project.

About

Open-source 3D-printable modular case for D-Robotics RDK X5 8GB. One base + three lids (closed/open frame/VESA mount). Fully parametric OpenSCAD source. CC BY 4.0.

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