Render sharp via and plated-hole pads at every zoom level

[imrishabh18]

Summary

• render via annuli as GPU-instanced analytic rings in both JSCAD and Manifold previews
• remove rasterized via and plated-hole pads from the combined board texture so the sharp preview geometry is the only visible copper edge
• harden antialiased removal-mask pixels to eliminate the residual fuzzy fringe
• reuse the same layer-aware raster-removal path for vias and all plated-hole pad shapes
• keep existing plated-hole geometry and board texture resolution unchanged
• exclude analytic via rings from GLTF exports, so GLTF/STEP and other model output sizes do not grow
• retain mipmaps and anisotropic filtering for the rest of the board texture

Root cause

The board texture and the sharp copper geometry overlapped. Antialiased edge pixels in the removal mask were only partially erased by destination-out, leaving a blurred/scalloped copper halo under close zoom.

Verification

• visually verified circular and rectangular/pill plated holes at close zoom in JSCAD and Manifold
• bun run build
• new unit coverage for shared via/plated-hole filtering and fully opaque removal-mask edges
• existing analytic-mesh and export-size safeguard tests pass
• full bun test: 29 pass; 3 existing failures remain from the unrelated local tscircuit dependency update (faux-board Z expectations and soldermask color expectation)

The unrelated package.json change is not included in this PR.

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Project	Deployment	Actions	Updated (UTC)
3d-viewer	Ready	Preview	Aug 5, 2026 7:35am