Tool for automating roughness/step height calculations from AFM measurements of wafer surfaces for hybrid bonding
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May 3, 2024 - Python
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hybrid-bonding
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True 3D Global Placement GUI Viewer -- An interactive 3D visualization demo for 3D IC placement. Built for the era of Huawei's Tao (τ) Law and Logic Folding, where 3D placement becomes the key enabler for next-generation chip density beyond Moore's Law.
threejs eda huawei 3d-visualization 3d-ic global-placement chip-design chiplet hybrid-bonding advanced-packaging logic-folding tau-law moore-law placement-viewer
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May 26, 2026 - HTML
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